Provide Heat Conduction and Cooling Solutions
PRODUCT
Highly stable and reliable thermal interface material
Thermal PAD
Thermal conductive pad can well fill the gap between the contact surfaces and squeeze air out of the contact surfaces. Air is a poor conductor of heat, which will seriously hinder the transfer of heat between the contact surfaces...
Thermal conductive sealant
Thermal conductive gel pad is a preformed thermal gap filling material, which can be solidified at room temperature or high temperature to form a flexible...
FEATURED PRODUCTS
Highly stable and reliable thermal interface material
HEAT CONDUCTION RADIO ABSORBING PAD
Like the traditional heat conduction interface materials, heat conduction microwave absorbing materials can be directly applied between heat source and radiator. While deriving heat, it can absorb leaked electrom agnetic radiation to eliminate electromagnetic interference. The heat conduction and microwave absorbing material with both thermal and electromagnetic countermeasures can solve problems in limited space and time without shielding cover, simplify structural design and reduce cost. At the same time, the soft silica gel substrate can reduce internal stress and allowable tolerance, Make the terminal products have higher reliability design, and provide good solutions for electronic commun cation products in terms of heat conduction and electromagnetic shielding.
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LC thermal silicone sheet is a universal and economical thermal sealing gasket with high cost performance, soft, self-adhesive and easy assembly. It shows good thermal conductivity and electrical insulation performance under low-pressure compression force. It paves the gap between the heating device and the heat sink or the machine shell, extrudes air to achieve full contact, and forms a continuous heat conduction channel. Using the heat sink or the machine shell as the heat sink, the heat dissipation area can be effectively improved, so as to effectively improve the heat dissipation effect.
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High thermal conductivity silicon film is characterized by high thermal conductivity and good insulation performance. The raw materials of the product are high thermal conductivity spherical aluminum oxide powder from DENKA and Dow Corning polymer. It is a cost-effective thermal insulation filling material with natural micro viscosity and softness on the surface, which can fully fill the air gap, Complete seamless heat transfer between heat source and heat sink to improve thermal conductivity. It is an ideal interface material for high performance heat conduction.
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Lc500-lc800 high thermal conductivity silicon film is a high-performanc e heat conduction interface material, which is made of imported raw ma terials. It is used to fill the air gap between the heating device and the he at sink or metal base. Their flexible and elastic characteristics enable it t o cover completely uneven surfaces. The heat is transferred from the sep arated device or the whole PCB to the metal shell or the diffusion plate, which can effectively improve the heat dissipation performance and the efficiency and service life of the heating electronic components.
Learn moreABOUT US
14 Years Of Focus On R & D And Production Of Thermal Interface Materials
Shenzhen Union Tenda Technology Co., Ltd was established in 2011, registered capital of 10 million, with an independent industrial park covering an area more than 10,000 square meters. which is a professional high-tech enterprise engaged in R&D, production and sales of thermal interface materials.
Production Base
Technology accumulation
R&D and technology investment
CERTIFICATE
Since its establishment, the company has successively passed: ISO9001 quality management system certification,ISO14001 environmental management system certification, ISO45001 occupational health and safety management system certification and IATF16949 quality management system certification
WHY CHOOSE US
Manufacturing Capability
R&D Capability
Cooperation Experience
Provide thermal conductivity and heat dissipation products and solutions for numerous customers
BLOG
Jul 09,2026
High-Performance Silicone Thermal Grease for Advanced Thermal Management Solutions
Silicone thermal grease improves heat transfer efficiency with stable performance and reliable thermal management.
Jun 30,2026
The Science Behind Ceramic Heat Sink Substrates and Their Applications
The Science Behind Ceramic Heat Sink Substrates and Their Applications Table of Contents 1. Introduction to Ceramic Heat Sink Substrates 2. What Are Ceramic Heat Sink Substrates? 3. Properties of Ceramic Materials 4. Advantages of Using Ceramic Heat Sink Substrates 5. Applications in Electronics 6. Automotive and Aerospace Applications 7. Future Trends in Ceramic Heat
Jun 29,2026
The Essential Guide to Silicone Thermal Interface Materials in Construction
Silicone thermal interface materials (TIMs) play a crucial role in various applications within the construction and building materials industry. They are designed to facilitate efficient thermal conduction between two surfaces, which is essential in many architectural and mechanical applications. In this guide, we will delve into the features, benefits, and usage scenarios of silicone thermal inte
Jun 28,2026
Thermal Conductive Silicone Caps: Enhancing Thermal Management Solutions in Modern Building Designs
Thermal Conductive Silicone Caps: Enhancing Thermal Management Solutions in Modern Building Designs Table of Contents Introduction to Thermal Conductive Silicone Caps What are Thermal Conductive Silicone Caps? Benefits of Using Thermal Conductive Silicone Caps Applications in Building Design Improving Energy Efficiency with Silicone Caps Impact on Indoor Air Quality In
Jun 27,2026
The Essential Role of Ceramic Substrates in Power Electronics
Ceramic substrates for power electronics are crucial materials that facilitate the effective operation of various electronic devices. These substrates are typically used in applications requiring high thermal conductivity, electrical insulation, and mechanical stability, making them an ideal choice for demanding environments, such as those found in the construction and decorative materials sectors
Jun 26,2026
Harnessing the Power of Thermal Materials in Smart Device Architecture
Harnessing the Power of Thermal Materials in Smart Device Architecture The rapid evolution of technology has given rise to an increasing need for smart devices that not only perform efficiently but also manage heat effectively. Thermal management is a critical aspect of smart device architecture, and the materials used play a significant role in optimizing functionality and ensuring longevity. As
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