Provide Heat Conduction and Cooling Solutions
PRODUCT
Highly stable and reliable thermal interface material
Thermal PAD
Thermal conductive pad can well fill the gap between the contact surfaces and squeeze air out of the contact surfaces. Air is a poor conductor of heat, which will seriously hinder the transfer of heat between the contact surfaces...
Thermal conductive sealant
Thermal conductive gel pad is a preformed thermal gap filling material, which can be solidified at room temperature or high temperature to form a flexible...
FEATURED PRODUCTS
Highly stable and reliable thermal interface material
Lc500-lc800 high thermal conductivity silicon film is a high-performanc e heat conduction interface material, which is made of imported raw ma terials. It is used to fill the air gap between the heating device and the he at sink or metal base. Their flexible and elastic characteristics enable it t o cover completely uneven surfaces. The heat is transferred from the sep arated device or the whole PCB to the metal shell or the diffusion plate, which can effectively improve the heat dissipation performance and the efficiency and service life of the heating electronic components.
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HEAT CONDUCTION RADIO ABSORBING PAD
Like the traditional heat conduction interface materials, heat conduction microwave absorbing materials can be directly applied between heat source and radiator. While deriving heat, it can absorb leaked electrom agnetic radiation to eliminate electromagnetic interference. The heat conduction and microwave absorbing material with both thermal and electromagnetic countermeasures can solve problems in limited space and time without shielding cover, simplify structural design and reduce cost. At the same time, the soft silica gel substrate can reduce internal stress and allowable tolerance, Make the terminal products have higher reliability design, and provide good solutions for electronic commun cation products in terms of heat conduction and electromagnetic shielding.
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LC thermal silicone sheet is a universal and economical thermal sealing gasket with high cost performance, soft, self-adhesive and easy assembly. It shows good thermal conductivity and electrical insulation performance under low-pressure compression force. It paves the gap between the heating device and the heat sink or the machine shell, extrudes air to achieve full contact, and forms a continuous heat conduction channel. Using the heat sink or the machine shell as the heat sink, the heat dissipation area can be effectively improved, so as to effectively improve the heat dissipation effect.
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High thermal conductivity silicon film is characterized by high thermal conductivity and good insulation performance. The raw materials of the product are high thermal conductivity spherical aluminum oxide powder from DENKA and Dow Corning polymer. It is a cost-effective thermal insulation filling material with natural micro viscosity and softness on the surface, which can fully fill the air gap, Complete seamless heat transfer between heat source and heat sink to improve thermal conductivity. It is an ideal interface material for high performance heat conduction.
Learn moreABOUT US
14 Years Of Focus On R & D And Production Of Thermal Interface Materials
Shenzhen Union Tenda Technology Co., Ltd was established in 2011, registered capital of 10 million, with an independent industrial park covering an area more than 10,000 square meters. which is a professional high-tech enterprise engaged in R&D, production and sales of thermal interface materials.
Production Base
Technology accumulation
R&D and technology investment
CERTIFICATE
Since its establishment, the company has successively passed: ISO9001 quality management system certification,ISO14001 environmental management system certification, ISO45001 occupational health and safety management system certification and IATF16949 quality management system certification
WHY CHOOSE US
Manufacturing Capability
R&D Capability
Cooperation Experience
Provide thermal conductivity and heat dissipation products and solutions for numerous customers
BLOG
Apr 15,2026
Smart Devices Revolution: How Thermal Materials Are Changing the Game
Smart Devices Revolution: How Thermal Materials Are Changing the Game Table of Contents 1. Introduction to Smart Devices and Thermal Materials 2. The Role of Thermal Materials in Smart Device Technology 3. Types of Thermal Materials Used in Smart Devices 4. Benefits of Advanced Thermal Materials in Smart Devices 5. Innovative Thermal Management Techniques 6. Case Studies:
Apr 14,2026
Exploring the Benefits and Applications of Ceramic Heat Sink Substrates in Construction
Ceramic heat sink substrates are increasingly becoming a vital component in the construction and decorative materials sector, especially in applications requiring effective thermal management. These substrates, typically made from advanced ceramic materials, offer superior thermal conductivity and insulation compared to traditional materials. This makes them particularly valuable in environments w
Apr 13,2026
Silicone Thermal Interface Material vs. Traditional Materials: A Comprehensive Comparison
Silicone Thermal Interface Material vs. Traditional Materials: A Comprehensive Comparison Table of Contents 1. Introduction to Thermal Interface Materials 2. What is Silicone Thermal Interface Material? 3. Overview of Traditional Thermal Interface Materials 4. Key Differences Between Silicone TIMs and Traditional Materials 5. Advantages of Using Silicone Thermal Interface Materials 6.
Apr 12,2026
Understanding Thermal Conductive Silicone Caps: Essential Insights for Construction Professionals
Thermal conductive silicone caps are specialized components widely used in various applications within the building and decoration materials sector, particularly in the manufacturing of other construction materials. Their primary function revolves around enhancing thermal management in electronic devices and construction elements, which is critical for ensuring longevity and performance. However,
Apr 11,2026
Why Power Electronics Depend on Ceramic Substrates for Efficiency
Understanding the Importance of Ceramic Substrates in Power Electronics Power electronics are at the forefront of modern technology, enabling efficient energy conversion and management across various applications, from renewable energy systems to electric vehicles. A critical component in achieving high efficiency in power electronic devices is the substrate material used in their construction.
Apr 10,2026
Innovative Thermal Materials for Enhanced Performance in Smart Devices
In the rapidly evolving world of smart devices, the management of thermal properties is critical to ensuring optimal performance and longevity. Thermal materials play an essential role in regulating heat, dissipating excess energy, and maintaining the integrity of electronic components. As devices become increasingly compact and powerful, the need for effective thermal management solutions becomes
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